Business Wire

Avishtech’s Latest Generation of Its Gauss Stack PCB Stack-Up Design and Simulation Software Features Skew Prediction Capability

SAN JOSE, Calif.--(BUSINESS WIRE)--Avishtech (www.avishtech.com), the leading provider of innovative EDA stack-up and 2D field solver solutions, today announced significant enhancements to its Gauss ...

Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging

Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world’s first ...
PlasticsToday

Cadence Launches AI Super Agent for PCB, Packaging Design

Cadence launches AuraStack AI Super Agent on Allegro AI Studio platform to automate PCB and advanced packaging design ...
Business Wire

Avishtech Introduces Latest Generation of Its Revolutionary Gauss Stack PCB Stack-Up Tool

SAN JOSE, Calif.--(BUSINESS WIRE)--Avishtech (www.avishtech.com), the leading provider of innovative EDA stack-up and 2D field solver solutions, today announced the availability of the latest version ...

Cadence Expands AI Agents With AuraStack For PCB And Advanced Chip Packaging

Cadence believes the next level of AI-assisted engineering resides at the system level, and to that end, the company just ...

Cadence's AuraStack agent melds AI with HPC to speed PCB, advanced packaging design

How AI will change the way scientific computing is done remains an open question. One relies on ultra-precise ...
NewsBytes

Cadence launches AuraStack AI for natural language PCB packaging design

Cadence Design Systems introduced AuraStack, an AI-powered agent that accelerates circuit board and chip packaging design, ...
DATAQUEST

Cadence intros AuraStack AI Super Agent -- world’s first Agentic AI platform for PCB and advanced packaging

Cadence AuraStack AI Super Agent, accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, coordinates domain-specific AI agents ...