As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking chips on top of each other. This vertically layered architecture could allow ...

Researchers developed a new chip stacking method that could quadruple AI memory density, potentially solving one of the ...

Most contemporary portable electronics, including laptops, smartphones and smart watches, are powered by batteries that need ...

Alibaba's chip unit T-Head open-sources its AI software stack SAIL to challenge Nvidia's CUDA dominance and help developers ...

HRL will present initial data from the project at the GOMACtech conference next week in Pasadena, Calif. HRL is directing the overall program, leading the system design, developing thermal isolation ...

Eight months after announcing a custom chip deal, OpenAI and Broadcom are revealing their first joint project: Jalapeño.

Nvidia's price-to-earnings (P/E) multiple is the lowest it's been in seven years.

Jalapeño marks OpenAI’s move into custom chips, while Broadcom strengthens its role as AI’s infrastructure provider.

Alibaba's T-Head unit open-sourced SAIL, the software stack for its Zhenwu AI chips, at WAIC. It follows Huawei's CANN open-sourcing and targets CUDA migration.